Lambda Technologies Introduces Continuous Flow Processing for Variable Frequency Microwave Curing Applications

Lambda Technologies has added a new MicroCure CF5100 continuous-flow model to its line of Variable Frequency Microwave (VFM) curing systems. The CF5100 is capable of processing a continuous flow of parts, without the need for closing doors or separating parts into batches. This enables faster processing of smart cards, flexible circuits and other products that are manufactured in sheets or formats such as reel-to-reel or reel-to-singulation. The CF5100 features a unique system of microwave chokes which completely contains microwaves within the curing area, allowing it to remain open to a conveyorized flow of parts. This permits faster processing while eliminating the uneven heating and costly preparation of large reels associated with batch curing in conventional ovens. Lambda Technologies' patented Variable Frequency Microwave (VFM) technology allows significantly faster curing of standard, off-the-shelf, polymeric adhesives and coatings used to encapuslate electronic components or attach them to circuit boards, while eliminating the hot spots and arcing associated with conventional microwave technology. Compared with conventional forced-convection heating, VFM speeds up cure rates by a factor of ten or more, greatly reducing work in process, inventory and labor costs. VFM systems occupy 30-40% less floor space than forced-convection systems, and consume virtually no energy while idling, resulting in additional savings. Also unlike convection heating, VFM allows selective focusing of microwave energy on a given material, such as the underfill adhesive between a flip-chip and substrate. This leaves the flip-chip and substrate much cooler than the adhesive, minimizing stress due to thermal mismatch and resulting in improved interconnect reliability and increased yields. Advanced packaging and assembly applications include post-mold cure, cavity dam & fill, glob-top, BGA and flip chip underfill, for die-attach, wafer processing, chip-on-board/direct chip-attach and chip-scale packaging.